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Thermal transport properties of monolayer phosphorene: a mini-review of theoretical studies

Guangzhao QIN, Ming HU

Frontiers in Energy 2018, Volume 12, Issue 1,   Pages 87-96 doi: 10.1007/s11708-018-0513-y

Abstract: Considering the fact that there have been so many studies on the thermal transport in phosphorene, itThere exists a huge deviation in the reported thermal conductivity of phosphorene in literature.It is found that the (vdW) interactions play a key role in the formation of resonant bonding, whichinto account of the vdW interactions and including the long-ranged interactions caused by the resonant bondingbonding in phosphorene.

Keywords： thermal transport     phosphorene     resonant bonding    

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The electrostatic-alloy bonding technique used in MEMS

WANG Wei, CHEN Wei-ping

Frontiers of Mechanical Engineering 2006, Volume 1, Issue 2,   Pages 238-241 doi: 10.1007/s11465-006-0011-5

Abstract: Electrostatic-alloy bonding of silicon wafer with glass deposited by Au to form Si/Au-glass water, andbonding of Si/Au-glass with silicon wafer were researched during fabrication of pressure sensors.then Si-Au alloy bonding was formed by annealing at 400vH for 2 h.The air sealability of the cavity after bonding was finally tested using the N filling method.The results indicate that large bond strength was obtained at the bonding interface.

Keywords： Si/Au-glass     strength     MEMS packaging     process     sandwich structure    

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Ultraviolet exposure enhanced silicon direct bonding

Guanglan LIAO, Xuekun ZHANG, Xiaohui LIN, Canghai MA, Lei NIE, Tielin SHI,

Frontiers of Mechanical Engineering 2010, Volume 5, Issue 1,   Pages 87-92 doi: 10.1007/s11465-009-0078-x

Abstract: the traditional wet chemical activation processes, is applied to enhance hydrophilic silicon direct bondingThe effects of UV exposure on silicon wafers’ nano-topography and bonding strength are studied.The correlations of annealing temperature and annealing time vs. bonding strength are experimentallyResults indicate that the bonding strength increases sharply then gently with increasing annealing temperatureIt follows from the results that the bonding strength of silicon wafer pairs with UV exposure decreases

Keywords： ultraviolet (UV) exposure     silicon direct bonding     bonding strength     reliability    

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Patterned wafer bonding using ultraviolet adhesive

Rui ZHUO, Guanglan LIAO, Wenliang LIU, Lei NIE, Tielin SHI

Frontiers of Mechanical Engineering 2011, Volume 6, Issue 2,   Pages 214-218 doi: 10.1007/s11465-011-0130-5

Abstract:

The process of patterned wafer bonding using ultraviolet (UV) adhesive as the intermediate layer wasappropriate pre-drying temperature (60°C), and predrying time (6 min), we obtained the intermediate layer bondingExperimental results indicate that patterned wafer bonding using UV adhesive is achieved under room temperaturehas advantages of easy operation, low cost, and no plugging or leakage in the patterned area after bondingPatterned wafer bonding using UV adhesive will have great potential in the fabrication of microfluidic

Keywords： ultraviolet (UV) adhesive     intermediate layer     patterned wafer bonding    

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A space solar cell bonding robot

FU Zhuang, ZHAO Yan-zheng, LIU Ren-qiang, DONG Zhi

Frontiers of Mechanical Engineering 2006, Volume 1, Issue 3,   Pages 360-363 doi: 10.1007/s11465-006-0027-x

Abstract: A space solar cell bonding robot system which consists of a three-axis Cartesian coordinate s robot,coating device, bonding device, orientation plate, and control subsystem was studied.

Keywords： Cartesian coordinate     thickness     three-axis Cartesian     orientation     control subsystem    

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Damage mode and failure mechanism of starch based API gluelam bonding

Shi Junyou,Xu Wenbiao and Wang Shumin

Strategic Study of CAE 2014, Volume 16, Issue 4,   Pages 40-44

Abstract:

The starch- based aqueous polymer isocycante（API）gluelam bonding as theresearch object，with tensile shear strength as a key evaluation index，accelerated aging tests on gluelam bondingto study damage mode and failure mechanism of the bonding The results show that：the adhesive fractureproperties of ductile fracture structure，and with the increase of aging time，the damage mode of the bonding

Keywords： bonding structure     accelerated aging     fracture character     damage mode    

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Towards Cr(VI)-free anodization of aluminum alloys for aerospace adhesive bonding applications: A review

Shoshan T. Abrahami, John M. M. de Kok, Herman Terryn, Johannes M. C. Mol

Frontiers of Chemical Science and Engineering 2017, Volume 11, Issue 3,   Pages 465-482 doi: 10.1007/s11705-017-1641-3

Abstract: For more than six decades, chromic acid anodizing (CAA) has been the central process in the surface pre-treatment of aluminum for adhesively bonded aircraft structures. Unfortunately, this electrolyte contains hexavalent chromium (Cr(VI)), a compound known for its toxicity and carcinogenic properties. To comply with the new strict international regulations, the Cr(VI)-era will soon have to come to an end. Anodizing aluminum in acid electrolytes produces a self-ordered porous oxide layer. Although different acids can be used to create this type of structure, the excellent adhesion and corrosion resistance that is currently achieved by the complete Cr(VI)-based process is not easily matched. This paper provides a critical overview and appraisal of proposed alternatives to CAA, including combinations of multiple anodizing steps, pre- and post anodizing treatments. The work is presented in terms of the modifications to the oxide properties, such as morphological features (e.g., pore size, barrier layer thickness) and surface chemistry, in order to evaluate the link between fundamental principles of adhesion and bond performance.

Keywords： aluminum     Cr(VI)-free     surface pre-treatments     anodizing     adhesive bonding    

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ARC welding method for bonding steel with aluminum

Zhenyang LU, Pengfei HUANG, Wenning GAO, Yan LI, Hanpeng ZHANG, Shuyan YIN

Frontiers of Mechanical Engineering 2009, Volume 4, Issue 2,   Pages 134-146 doi: 10.1007/s11465-009-0033-x

Abstract: When welding steel with aluminum, the appearance of intermetallic compounds of Fe and Al will decrease tenacity and increase rigidity, which leads to bad joint performance. A new type of low energy input (LEI) welding technology is introduced which can be used to weld steel with aluminum. Using the technology, brazing was located on the steel side and arc fusion welding on the aluminum side. The less heat input reduces the thickness of intermetallic compounds to 3-4 μm. Tensile strength tests prove that the joint breaks at the heat-affected zone and the strength is higher than 70% of the aluminum’s. Thus, the method can lead to a good performance joint.

Keywords： joining of steel and aluminum     low energy input welding     arc welding     fusion welding – brazing    

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Packaging of Micro Electro Mechanical Systems Based on Bulk Silicon Bonding and Film Sealed Technology

Wang Weiyuan,Wang Yuelin

Strategic Study of CAE 2002, Volume 4, Issue 6,   Pages 56-62

Abstract: It is based on bulk silicon bonding technology and film sealed technology.The bulk silicon bonding technology includes electrostatic bonding, silicon direct bonding and interfaciallayer assisted bonding.

Keywords： packaging of MEMS     bulk silicon bonding technology     film-sealed technology    

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Hyperbranched magnetic polymer: highly efficient removal of Cr(VI) and application in electroplating wastewater

Frontiers of Chemical Science and Engineering 2023, Volume 17, Issue 10,   Pages 1568-1580 doi: 10.1007/s11705-023-2303-2

Abstract: By using a two-step hydrothermal method and trithiocyanuric acid (TTCA), 2,4,6-trihydrazino-1,3,5-triazine (THT), and Fe3O4 as raw materials, a spherical magnetic adsorbent polymer (TTCA/THT@Fe3O4) was synthesized to achieve the efficient removal of Cr(VI) from wastewater. Under optimal adsorption conditions, the maximum adsorption capacity of TTCA/THT@Fe3O4 for Cr(VI) can reach 1340 mg∙g‒1. Notably, the removal efficiency can approach 98.9%, even at the lower concentration of 20 mg∙L‒1 Cr(VI). For actual wastewater containing Cr(VI), the Cr(VI) concentration was reduced from 25.8 to 0.4 mg∙L‒1, a remarkable 20% lower than the current industry discharge standard value. A mechanism for the high adsorption performance of Cr(VI) on TTCA/THT@Fe3O4 was investigated using Fourier transform infrared spectroscopy, X-ray photoelectron spectroscopy, and density functional theory. It can be plausibly attributed to the formation of Cr/N and Cr/S coordination bonds. Additionally, surface electrostatic adsorption, reduction effects, and the spherical polymer structure increase the contact area with Cr(VI), maximizing adsorption. The synergistic effect of adsorption and reduction enhances the adsorption performance of TTCA/THT@Fe3O4 for Cr(VI) and total chromium in water. The resultant polymer has a simple preparation process, excellent adsorption performance, easy magnetic separation, and promising application for actual wastewater.

Keywords： magnetic polymer     chromium removal     hydrogen bonding     recyclability     actual wastewater    

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A Smart Procedure for the Femtosecond Laser-Based Fabrication of a Polymeric Lab-on-a-Chip for Capturing Tumor Cell Article

Annalisa Volpe, Udith Krishnan, Maria Serena Chiriacò, Elisabetta Primiceri, Antonio Ancona, Francesco Ferrara

Engineering 2021, Volume 7, Issue 10,   Pages 1436-1442 doi: 10.1016/j.eng.2020.10.012

Abstract:

Rapid prototyping methods for the design and fabrication of polymeric labs-on-a-chip are on the rise, as they allow high degrees of precision and flexibility. For example, a microfluidic platform may require an optimization phase inwhich it could be necessary to continuously modify the architecture and geometry; however, this is only possible if easy, controllable fabrication methods and low-cost materials are available. In this paper, we describe the realization process of a microfluidic tool, from the computer-aided design (CAD) to the proof-of-concept application as a capture device for circulating tumor cells (CTCs). The entire platform was realized in polymethyl methacrylate (PMMA), combining femtosecond (fs) laser and micromilling fabrication technologies. The multilayer device was assembled through a facile and low-cost solvent-assisted method. A serpentine microchannel was then directly biofunctionalized by immobilizing capture probes able to distinguish cancer from non-cancer cells without labeling. The low material costs, customizable methods, and biological application of the realized platform make it a suitable model for industrial exploitation and applications at the point of care.

Keywords： Lab-on-a-chip     Fs laser     Circulating tumor cells     Point of care     Thermal bonding     Polymers    

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Influence evaluation of loading conditions during pressurized thermal shock transients based on thermal-hydraulics

Jinya KATSUYAMA, Shumpei UNO, Tadashi WATANABE, Yinsheng LI

Frontiers of Mechanical Engineering 2018, Volume 13, Issue 4,   Pages 563-570 doi: 10.1007/s11465-018-0487-9

Abstract:

The thermal hydraulic (TH) behavior of coo-lant water is a key factor in the structural integrityassessments on reactor pressure vessels (RPVs) of pressurized water reactors (PWRs) under pressurized thermalanalysis with different operator action times, we also performed structural analyses for evaluating thermal-stress

Keywords： structural integrity     reactor pressure vessel     pressurized thermal shock     thermal hydraulic analysis     pressurized    

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Assessment indices for uniform and non-uniform thermal environments

ZHANG Yufeng, SUN Shufeng, ZHAO Rongyi

Frontiers in Energy 2008, Volume 2, Issue 2,   Pages 129-133 doi: 10.1007/s11708-008-0029-y

Abstract: Different assessment indices for thermal environments were compared and selected for proper assessmentof indoor thermal environments. 30 subjects reported their overall thermal sensation, thermal comfort, and thermal acceptability in uniform and non-uniform conditions.However, overall thermal sensation differs from the other two indices and cannot be used as a proper

Keywords： thermal sensation     proper assessment     relationship     equivalent     thermal acceptability    

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Liquid metal thermal hydraulics R&D at European scale: achievements and prospects

Frontiers in Energy 2021, Volume 15, Issue 4,   Pages 842-853 doi: 10.1007/s11708-021-0743-2

Abstract: Commission in the past 20 years in the fields of liquid-metal heat transfer modeling, fuel assembly and core thermalhydraulics, pool and system thermal hydraulics, and establishment of best practice guidelines and verificationanalysis of the consequences of fuel assembly blockages on coolant flow and temperature, analysis of the thermalhydraulic effects in deformed fuel assemblies, extended validation of three-dimensional pool thermalhydraulic CFD models, and further development and validation of multi-scale system thermal hydraulic

Keywords： liquid metal     thermal hydraulics     Europe    

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Performance of steel bridge deck pavement structure with ultra high performance concrete based on resin bonding

Frontiers of Structural and Civil Engineering 2021, Volume 15, Issue 4,   Pages 895-904 doi: 10.1007/s11709-021-0759-z

Abstract: The EP bonding layer can nearly double the drawing strength of the pavement interface from 1.3 MPa, and

Keywords： steel bridge deck pavement     ultra-high-performance concrete     epoxy resin     composite structure     bending fatigue performance    

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Title Author Date Type Operation

Thermal transport properties of monolayer phosphorene: a mini-review of theoretical studies

Guangzhao QIN, Ming HU

Journal Article

The electrostatic-alloy bonding technique used in MEMS

WANG Wei, CHEN Wei-ping

Journal Article

Ultraviolet exposure enhanced silicon direct bonding

Guanglan LIAO, Xuekun ZHANG, Xiaohui LIN, Canghai MA, Lei NIE, Tielin SHI,

Journal Article

Patterned wafer bonding using ultraviolet adhesive

Rui ZHUO, Guanglan LIAO, Wenliang LIU, Lei NIE, Tielin SHI

Journal Article

A space solar cell bonding robot

FU Zhuang, ZHAO Yan-zheng, LIU Ren-qiang, DONG Zhi

Journal Article

Damage mode and failure mechanism of starch based API gluelam bonding

Shi Junyou,Xu Wenbiao and Wang Shumin

Journal Article

Towards Cr(VI)-free anodization of aluminum alloys for aerospace adhesive bonding applications: A review

Shoshan T. Abrahami, John M. M. de Kok, Herman Terryn, Johannes M. C. Mol

Journal Article

ARC welding method for bonding steel with aluminum

Zhenyang LU, Pengfei HUANG, Wenning GAO, Yan LI, Hanpeng ZHANG, Shuyan YIN

Journal Article

Packaging of Micro Electro Mechanical Systems Based on Bulk Silicon Bonding and Film Sealed Technology

Wang Weiyuan,Wang Yuelin

Journal Article

Hyperbranched magnetic polymer: highly efficient removal of Cr(VI) and application in electroplating wastewater

Journal Article

A Smart Procedure for the Femtosecond Laser-Based Fabrication of a Polymeric Lab-on-a-Chip for Capturing Tumor Cell

Annalisa Volpe, Udith Krishnan, Maria Serena Chiriacò, Elisabetta Primiceri, Antonio Ancona, Francesco Ferrara

Journal Article

Influence evaluation of loading conditions during pressurized thermal shock transients based on thermal-hydraulics

Jinya KATSUYAMA, Shumpei UNO, Tadashi WATANABE, Yinsheng LI

Journal Article

Assessment indices for uniform and non-uniform thermal environments

ZHANG Yufeng, SUN Shufeng, ZHAO Rongyi

Journal Article

Liquid metal thermal hydraulics R&D at European scale: achievements and prospects

Journal Article

Performance of steel bridge deck pavement structure with ultra high performance concrete based on resin bonding

Journal Article